Under the hood of the Type-S: iVTEC?
Now, let's pull the shell off this thing and see how Shuttle has improved the guts.

Note several things in the picture above. First, the black strip running along the bottom edge of the chassis is made of soft foam, presumably to prevent vibrations. Also, you can kind of see here how the extra 20mm of chassis width offers a little more clearance between the drive cage and the AGP card.
The biggest news inside the SB75S is the attention Shuttle has paid to internal cable routing and labeling. Above, you can see a neatly folded ATA cable running along the top of the case. Here are a few more shots to give you a better sense of what Shuttle has done.





This little dose of extra effort in cable routing and labeling pays big dividends in the overall look of a finished XPC system and in ease of assembly. Of course, Shuttle's trick ICE heat-pipe cooler doesn't hurt, either.

| Socket FM2 Trinity motherboard pictured | 14 |