moriz wrote:-the larger pin holes MIGHT cause issues with AM3 boards that supposedly supports AM3+ cpus, since the pins themselves might be thicker as well. this is very unlikely
moriz wrote:-if the AM3 socket is capable of 110A maximum, and the typical voltage of current phenom IIs is 1.375V (150W TDP max), then assuming for the same maximum TDP on AM3+, 145A maximum means that bulldozers operate at 1.034V. of course, its possible that bulldozer operate at the same voltage, which means that they'll have a max TDP of 200W, which is pretty ridiculous. maybe the coolermaster V10 finally have a use after all
mikeymike wrote:I find it amusing that ASRock are talking about AM3+ needing higher current as if that's a good thing Point 2 is quite amusing as well
mikeymike wrote:Point 6 about ventilation is making me think "err, wot?" The AM3+ HSF retention system looks like a money-saving design, rather than it helping with ventilation in any significant way. I realise that fluid dynamics is a complex enough topic, and that I've never studied it, but I would be quite surprised if removing a piece of plastic that small would yield a 5C temp reduction. Even if the plastic was completely flush against the side of the HSF (I don't think it is), I don't think it is tall enough to cause that much of a problem.
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