mortifiedPenguin wrote:A few months ago I reapplied my TIM using the "spread as thinly as humanly possible with a plastic bag on your finger" method on both the CPU and HSF. It dropped 5-10C from the original application using the "rice grain sized drop" method with a TRUE and an OC'd Q9450. Maybe I just put too much the first time and I don't remember what the exact temps were.
Did you pre-fill the "channels" (in between the heat pipes and the separators) with a little bit more paste material?edh wrote:CPU: Core i7-960 -- Heat sink: Xigmatek HDT-S1283 -- TIM: Shin-Etsu MicroSi G751 (MassCool)
I used a "wipe & triple-stripe" method with my most recent build. I "zip-lock baggied" my finger and wiped both the CPU and the heat sink, making sure that I got TIM paste in all the crevasses. Then I put a very thin stripe along each of the three copper pipes patterned much like that on your example page except that my stripes were a little longer -- probably 3/4ths the length of the contact area of the copper surface (and on the copper surface instead of the aluminum dividers).
Flying Fox wrote:Did you pre-fill the "channels" (in between the heat pipes and the separators) with a little bit more paste material?
I also remember that before I locked down the 4 legs, I wiggle the HSF in both clockwise and counterclockwise directions. I might also have done a pair of north-south and east-west horizontal sliding motion as well. Then I lock down the legs.
In addition to the baggie wipe, I also used those plastic cards they send you in the mail for a straight edge I think.edh wrote:Flying Fox wrote:Did you pre-fill the "channels" (in between the heat pipes and the separators) with a little bit more paste material?
Yes, did that with the "baggie-wipe." The MassCool goop I used is more paste-like than Arctic Silver 5.
edh wrote:I also remember that before I locked down the 4 legs, I wiggle the HSF in both clockwise and counterclockwise directions. I might also have done a pair of north-south and east-west horizontal sliding motion as well. Then I lock down the legs.
The heat sink shuffle? Latest dance craze! LOL! Yes, I do that, too. Although I screwed the HDT-S1283 to its metal metal bracket underneath the motherboard instead of using pushpin clips. I don't trust those things except with very light heat sinks (like those provided with Intel's retail packaging).
You could be right, I tend to have Core 0 ~10 C higher than the other three. Perhaps I'll try the line method next time and compare. I'm using AC5 though, so I'm not sure I'll be patient enough to just let it cure.Flying Fox wrote:IIRC the C2Q requires the "line method" to cover the cores better? I wonder if someone has some results to report for the line method.
just brew it! wrote:So... does the shape of your thermal paste pattern reveal "the inner you"? Inquiring minds want to know.
swaaye wrote:According to the Arctic Silver folks, the logic behind the bead/line methods is that when you put the cooler on and mush it out, the result will have less air trapped than if you spread it yourself. Also, the critical point of heat transfer on the heatspreader is the area above the core. You want the application as thin as possible over this area and as little air in the goo as possible. The rest of the heatspreader is actually rather unimportant.
Flying Fox wrote:Actually AS5 has been talking up the line method ever since we have slapped-together dual/quad cores on the market? A lot of people still talk about the rice/bb pattern based on a little bit older knowledge. Then again, with the advent of IHSes the need to get the perfect pattern has diminished.
SpotTheCat wrote:I use the line method on newer intel stuff. I run the tube nearly perpendicular to the can so I get very low-profile lines. I also run them as straight and as perpendicular as I can.
mph_Ragnarok wrote:I just put a rice-grain sized scoop in the middle of the CPU, and then the pressure spreads it awesomely.
All you other people are wasting time. It looks exactly the same after the pressure squeezes it out.
Neutronbeam wrote:I may have missed it in the messages above, but isn't anyone lapping heatsinks anymore? Even HDT models? Unless something has a mirror finish [very unlikely] I'm probably going to do a little lapping before applying paste.
mph_Ragnarok wrote:Well, fragnificent, I've tried it as well and I find that it makes no difference in temperatures.
So suck a lemon.
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