DeadOfKnight wrote:As far as heat dissipation, would the tighter package make a big difference?
What tighter package? Other than being a fraction of a mm thinner it looks like it is the same?
Personal computing discussed
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DeadOfKnight wrote:As far as heat dissipation, would the tighter package make a big difference?
just brew it! wrote:What tighter package? Other than being a fraction of a mm thinner it looks like it is the same?
AbRASiON wrote:I just did some reading on this puppy - apparently this thing might STILL have SATA2 ports on the boards shipping at the time, madness :/
I would love an excuse to upgrade but jeez, it doesn't sound like it'll bring much to the table.
AbRASiON wrote:I just did some reading on this puppy - apparently this thing might STILL have SATA2 ports on the boards shipping at the time, madness :/
I would love an excuse to upgrade but jeez, it doesn't sound like it'll bring much to the table.
DeadOfKnight wrote:I doubt it.
It'll save people money if they don't, and most devices won't suffer for it even still. It would be nice since they're backward-compatible, but it's not necessary.
Mouse, keyboard, webcam, headset...pretty much anything that doesn't need more power or bandwidth doesn't need USB 3.
DeadOfKnight wrote:I doubt it.
It'll save people money if they don't, and most devices won't suffer for it even still. It would be nice since they're backward-compatible, but it's not necessary.
Mouse, keyboard, webcam, headset...pretty much anything that doesn't need more power or bandwidth doesn't need USB 3.
Diplomacy42 wrote:Wish my phone would charge faster with all that extra juice... I'd even give apple a kudos if they figured it out.
Seems like iPhone with its asymmetric battery packs should be able to charge up to 4x faster, but no...
Oh well, I'm still not buying an apple anything unless they strike a licensing deal with google and bury this patent silliness where it belongs.
derFunkenstein wrote:This thing is going to be all sorts of fast.
DeadOfKnight wrote:derFunkenstein wrote:This thing is going to be all sorts of fast.
I was listening to the first podcast on AnandTech and Anand let slip that he's quite positive Haswell uses the better thermal interface from before Ivy Bridge.
Basically this thing is going to be an overclocking monster.
Airmantharp wrote:I'm going to ask this in general here: do any of you know if people are having good luck with popping the IHS off of Ivy CPUs and replacing the TIM for better overclocking?
DPete27 wrote:Any word on what SKUs will be in the inial release? I'd love to nab a power-sipping i3 Haswell with the better graphics for my HTPC so that I can also do a bit of light iGPU gaming with it. But, if history is any indicator, those won't come out until ~6 months after the initial release.
anotherengineer wrote:I speculate it will be made from silicon.
Diplomacy42 wrote:isn't that a little like cutting the butter with a steak knife?
chuckula wrote:anotherengineer wrote:I speculate it will be made from silicon.
That crazy talk! Everyone knows it is made from ground unicorn horns!
DPete27 wrote:For HTPC requirements, yes, but for light gaming, I dont think so.
Heck, given the purported 10W TDP of the ULV mobile processors, maybe I'll be able to get my hands on a mini-PC with a Haswell mobile chip in it
DPete27 wrote:Thanks for the link. My impressions: A lot of stuff we already knew, or could infer from past statements (eg, the two new ports were necessary to not bottleneck FMA). But the L1 and L2 cache improvements are significant, and pretty remarkable considering how much optimization had already gone into them. That benefits everything without requiring code changes (and incidentally should aid TSX, since that is extremely cache-dependent). Most of the juicy details on the genuinely new stuff are waiting on the later presentations, however.Intel Developer Forum presentation on Haswell going on right now, anandtech has it live!