Well, this is probably a noobish question, since I pride myself with the fact that I've been in contact with computers and overclocking for more than 10 years, but I can not figure this out.
So, we pretty much know that Haswell chips will have on-die integrated power delivery systems, yet all the new high-end Z87 boards still have huge, sometimes actively cooled radiators covering their power phases. Even the number of power phases varies. Weren't those supposed to be inside the chip itself?
Can the board manufacturers implement extra power phases in a useful way and do they work in parallel with FIVR? Or are those just for show?