Even back in 2008, we were hearing that AMD could use TSMC's 40-nm bulk silicon process to build its first Fusion CPU-GPU chimera. DigiTimes has resurrected that rumor, adding few details but quoting its ever-reliable "industry sources":
AMD reportedly plans to outsource wafer starts for its Fusion CPUs with integrated graphics to Taiwan Semiconductor Manufacturing Company (TSMC) using bulk 40nm process technology, and related backend services to Siliconware Precision Industries (SPIL), according to industry sources.
The site goes on to point out that AMD has already started sampling Llano hybrids based on GlobalFoundries' 32-nm silicon-on-insulator process. Llano, of course, is AMD's upcoming quad-core Accelerated Processing Unit (AMD shorthand for a CPU with a graphics processor built in). AMD's roadmaps also point to a dual-core Ontario APU being based on 32-nm SOI technology. If the company does use TSMC's bulk process, then, it might be for some other APU—or perhaps Ontario will simply include a separate GPU die built by TSMC. Our understanding is that Llano will combine CPU and GPU cores on a single chip.
|Rumor: Radeon RX Vega benched in 3DMark Fire Strike||10|
|AMD turned a $25 million operating profit in Q2 2017||1|
|National Merry-Go-Round Day Shortbread||4|
|Flash will be dead by end of 2020||25|
|Adata wants to brighten your life with its XPG Spectrix D40 RAM||3|
|Rumor: Geekbench entry hints at 16-core Core i9-7960X performance||11|
|GeForce 384.94 drivers bring a bevy of security fixes||6|
|Thermaltake Smart RGB PSUs dazzle budget builders||7|
|Google releases last developer preview before Android O release||19|