Intel has silicon from 0.13µ, 300mm wafer fab


— 7:22 AM on April 3, 2001

From the press release:

Intel Corporation has completed production of its first silicon chips from its 0.13 micron technology, 300 millimeter (mm) wafer development fab located here. Named D1C, this factory is the first in the industry to produce fully functional computer chips built using advanced 0.13 micron process technology on the new, larger 300 mm wafers. This milestone keeps Intel on track to bring chips built on these advanced technologies into the marketplace at the beginning of next year.
More here.
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