CPU coolers with vertical vapor chambers are nothing new; Cooler Master has been making them since 2012. But the company showed off a new prototype at CES that takes integration to the next level. Instead of connecting the vapor chambers to the CPU block with solder, Cooler Master has made them an integral part of the slug.
The prototype has four vertical chambers sprouting from its copper base. The rest of the assembly includes a collection of heatpipes, but Cooler Master told us the final version will rely solely on vapor chambers to transfer heat between the CPU block and radiator fins.
Tower-style coolers with these "3D vapor chambers" are due this year. They'll be competitively priced, according to Cooler Master, and I'm curious to see how they perform versus more traditional towers.
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