Samsung has developed a fingernail-sized device with enough memory and storage for high-end smartphones. This ePoP, or embedded package on package, combines 3GB of LPDDR3-1866 memory with 32GB of eMMC storage. Those components are typically separate, but they've been squeezed into a package that's small enough to stack on top of an SoC. Samsung's SoC-and-ePoP combo takes up just 15 x 15 x 1.4 mm.
Awww, isn't the ePoP cute?
According to the press release, the DRAM "sports a 64-bit I/O bandwidth," which presumably refers to the width of the memory interface. There's no mention of the speed or nature of the embedded flash.
|AMD says its Vega cards will launch "over the next couple of months"||63|
|Samsung's high-end Chromebook Pro will be available May 28||18|
|GeForce 382.33 drivers are ready for a match of Tekken 7||0|
|HP upgrades Envy and Spectre x2 laptop lineups||24|
|Asus ROG Strix X370-F and B350-F mobos take wing||4|
|MSI debuts slot-powered Radeon RX 560 Aero ITX OC cards||15|
|Lian-Li PC-O12WX puts graphics cards under glass||7|
|Asus B250I Gaming brings ROG Strix bling at a lower price||17|
|Lenovo Legion Y920 is a mobile gaming beast||14|
|Generals sure. Colonels, not so much.||+20|