SanDisk and Toshiba unveil 256Gb 3D flash chips


— 11:29 AM on August 4, 2015

Get out your 3D glasses, everybody. SanDisk and Toshiba's latest NAND chips cram 32GB (256Gb) of the companies' BiCS flash memory into 48 layers of TLC storage per die. It wasn't that long ago that we saw 16GB (128Gb) MLC BiCS flash chips from Toshiba, but these TLC chips represent a significant increase in density.

Toshiba and SanDisk expect that these TLC chips will find homes in devices like SSDs, smartphones, tablets, memory cards, and even enterprise storage devices. Toshiba says it'll begin sampling the new chips in September, while SanDisk says that the denser memory will begin appearing in its products sometime in 2016.

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