TSMC is already thinking a few moves ahead of its present processes. According to DigiTimes, the company expects to start production of 7-nm chips in 2018, and it thinks its rollout of 5-nm process tech will begin in the first half of 2020.
TSMC has reportedly been researching production at the 5-nm node for over a year. The company says it's made "significant progress" in using EUV (extreme ultraviolet) lithography, and says it'll most likely deploy this know-how at the 5-nm node.
The firm also hopes to tape out customer designs based on the 10-nm process during the first quarter of this year. The foundry expects to follow that up with a new 16-nm FFC (FinFET Compact) process, a version of its 16-nm node with lower power requirements and lower production cost. TSMC expects to own over 70% of the 14- and 16-nm fab market in 2016, rising from 40% in 2015.
Last but not least, the firm is looking to start volume production of its integrated fan-out (InFO) wafer packaging in the second half of this year, for "a few very large volume customers."
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