Rumor: Intel 300-series chipsets pack USB 3.1 and Wi-Fi support


— 9:00 AM on April 17, 2017

Benchlife is showing off another purported Intel slide with some pretty juicy details about that company's next desktop chipset series. The image appears to describe the upcoming 300-series chipsets intended for use with the chip giant's "Cannon Lake" processor family. Most notably, the chips are rumored to include support for USB 3.1 (10 Gbps) and 802.11ac Wi-Fi.


Source: Benchlife

Aside from the two new features, the rumored 300-series chipsets look to be pretty similar to existing 200-series offerings. That means they include connectivity for up to 24 lanes of PCIe 3.0, up to 10 USB 3.0 ports, and six 6Gbps SATA ports. Benchlife goes on to say that much like previous generations, there will be a range of chipsets in the 300-series including the whole alphabet soup of Z, Q, H, and B-series models with progressively-reduced capabilities. If this info checks out, you can bet that Wi-Fi will be one of the first things to go as you move down the product stack.

The site also says that Intel's next Core chips will be again built on 14-nm technology, something we heard earlier this year. According to that earlier report, it's possible that Cannon Lake desktop processors could come out on a 14-nm process, while mobile processors use a 10-nm process. The new rumors today pertain to the desktop chipsets ("-S" platform), but the benefits of integrating Wi-Fi into the mobile chipsets should be obvious. Benchlife says the desktop Cannon Lake processors are scheduled for release in Q4 of this year.

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