Under the hood
Children, hide your eyes. It's time to undress the H2. The first thing you'll notice removing the side panels is the layer of acoustic foam that has been professionally applied to the inner face. The foam is not incredibly dense, but it is a nice-looking touch that does have a small positive effect on noise pollution.
One of the most common complaints I see these days is that cases manufacturers waste space on extraneous 5.25" drive bays that could be put to better use housing additional hard drives. NZXT seems to have taken this complaint to heart, because the H2 includes only three external bays (all 5.25") and eight tool-less internal 3.5" bays. The drive sleds will accept 2.5" devices like SSDs, but you'll have to affix these using something called a "screwdriver"—yeah, I didn't know what that was either. Despite the complete lack of external 3.5" bays, there is unfortunately no adapter included to mount such drives in a free 5.25" slot.
The motherboard tray is riddled with holes intended to assist with cable management and heatsink installation. These holes work well for the most part, but the protective rubber grommets are so soft that they refuse to stay in place as you pass cables through them. This fact was a constant source of frustration during the build process, evoking some language I wouldn't use within earshot of my mother.
The other side of the case leaves approximately an inch of clearance between the motherboard tray and the side panel to hide cables. Use of a modular power supply will make life much easier back here. In the box, two small baggies of zip ties are included to assist with cable management. The biggest issue with this cable crawl space is the old-school, sliding side panel. Since the inside face is covered in acoustic foam, the available empty space you have to work with when hiding cables is reduced. Replacing the panel without tearing the foam can be tricky if you have large bundles of cables tucked away.
|Amazon's Echo Look uses machine learning to dress you up||17|
|EK machines a waterblock for the ROG Maximus IX Apex||2|
|Microsoft describes how it uses telemetry data for smoother updates||19|
|id software talks about Ryzen||75|
|FSP hits the heatsink market with its Windale CPU coolers||16|
|Steelseries Qck Prism is a lit stage for your mouse||24|
|Biostar shows up fashionably late to the Radeon 500-series party||10|
|MSI lets loose a trio of Optane motherboard bundles||12|
|GeForce 381.89 drivers power up their armor for Dawn of War III||8|
|Love the packaging. For the love of god - this minimalism and colour scheme on regular people cards, please.||+53|