Personal computing discussed
Moderators: renee, Flying Fox, morphine
DrDominodog51 wrote:Dammit. You beat me to posting this.
just brew it! wrote:Hitting the power carrying capacity of an 8-pin power connector is more problematic, as there's no DIY solution to this which doesn't involve modifying the board itself.
Mr Bill wrote:an ounce or so of 99.999% silver should do the trick!
Kougar wrote:Yeah, liquid metals freeze just below room temperature. Even mercury can only make it down to -38C before freezing.Mr Bill wrote:an ounce or so of 99.999% silver should do the trick!
Don't think even gold will help when he was pulling 1,000 watts from a 7980XE Props for him keeping all 18 cores & HT active at 6.1Ghz, nevermind on a chip with a FIVR which limits how cold it can go. Link Kind of amazing X299 VRMs can survive that, let alone the board itself. Also, sort of a musing liquid metal is apparently useless for subzero overclocking.
Mr Bill wrote:Did he mention how he managed to keep temperature above -100C with a -195C liquid?
DrDominodog51 wrote:OK, I was wondering if they might go with mixtures. We used to use pentane and lN2 to make a bath that was stable at -131 as long as chunks of pentane were visible along with liquid. There are more combinations here on wikipedia.Mr Bill wrote:Did he mention how he managed to keep temperature above -100C with a -195C liquid?
You only put enough LN2 into the pot to keep it around that temperature. LN2 pots tend to have fairly large copper bases that can make it a bit easier to control the temperature.
Mr Bill wrote:Yeah, liquid metals freeze just below room temperature. Even mercury can only make it down to -38C before freezing.
Kougar wrote:Misunderstood your intent. I thought you were talking about liquid metal that would be liquid as a fluid heat exchange medium. oopsMr Bill wrote:Yeah, liquid metals freeze just below room temperature. Even mercury can only make it down to -38C before freezing.
I would have thought solidified frozen liquid metal would've been a better medium for thermal transfer at that point, it's not any different than soldering the IHS do the chip right? I don't understand the distinction so it got my attention.
He mentioned in the vid he was forced to add a little bit of LN2 every so many seconds to keep the temp as close to the cold bug threshold without crossing it. Did you see the part where he discussed that delidding and filling the entire underside of the IHS with thermal compound gave him the best and most consistent OC results? Have to buy TIM in Costco sizes, which he apparently does going by the size of the jar on his desk.
Kougar wrote:Hrumph, well then, I think the main point (after watching them put it on in the video), is that this (kryopaste) can be spread all over the entire chip package (due to being an effective electrical insulator) and thus allow the whole CPU package and socket to be cooled. That would be necessary when dissipating 700W in that small a volume.My point was der8auer stated liquid metal performs worse at subzero cooling than TIM. I'm not talking about soldering the chip, my comparison is that frozen "liquid metal" would be a solid and not much different from a typical soldered chip at those temps, so I am perplexed as to why it would perform worse than paste TIM.
Kougar wrote:My point was der8auer stated liquid metal performs worse at subzero cooling than TIM. I'm not talking about soldering the chip, my comparison is that frozen "liquid metal" would be a solid and not much different from a typical soldered chip at those temps, so I am perplexed as to why it would perform worse than paste TIM.
jihadjoe wrote:I imagine it'd depend on how the liquid metal crystallizes as it freezes. Depending on how that happens it might contract into clumps and leave huge gaps of silicon without any interface to the heatspreader.
jihadjoe wrote:Kougar wrote:My point was der8auer stated liquid metal performs worse at subzero cooling than TIM. I'm not talking about soldering the chip, my comparison is that frozen "liquid metal" would be a solid and not much different from a typical soldered chip at those temps, so I am perplexed as to why it would perform worse than paste TIM.
I imagine it'd depend on how the liquid metal crystallizes as it freezes. Depending on how that happens it might contract into clumps and leave huge gaps of silicon without any interface to the heatspreader.
Kougar wrote:Just realized I meant to say the kryopaste could be slathered all over the socket due to being an insulator but liquid metal would be a conductor and short out the socket if you slathered it all over.Mr. Bill, yeah that'd be another point in the liquid metal's favor. Der8auer already filled the entire IHS with paste, looked akin to someone plastering a wall.