Personal computing discussed

Moderators: renee, Flying Fox, morphine

 
JustAnEngineer
Gerbil God
Topic Author
Posts: 19661
Joined: Sat Jan 26, 2002 7:00 pm
Location: The Heart of Dixie

Everyone wants interposers!

Mon Apr 13, 2020 6:22 pm

https://wccftech.com/tsmc-cowos-product ... terposers/
TSMC's demand for Chip-on-Wafer-on-Substrate (CoWoS) packing has skyrocketed, according to DigiTimes' unnamed source. Big names such as Nvidia, AMD, HiSilicon, Xilinx, and Broadcom are all knocking on TSMC's door to some CoWoS packing so they can use it for high bandwidth powered AI accelerators and ASICs over the past two weeks. This has led to TSMC ramping up production to full capacity at their fabs.
· R5-3600X, Liquid Freezer II 280, RoG Strix X570-E, 64GiB PC4-28800, RTX3080, 2TB SX8200Pro +2TB MX500 +NAS, Define 7 Compact, Focus PX-850, S3220DGF +32UD99, FC900R OE, DeathAdder Chroma
 
Wirko
Gerbil Team Leader
Posts: 296
Joined: Fri Jun 15, 2007 4:38 am
Location: Central Europe

Re: Everyone wants interposers!

Tue Apr 14, 2020 7:52 am

Mostly the same news but without wccftechly comments:
https://www.techpowerup.com/265631/tsmc-sees-higher-demand-for-cowos-packaging

Anyway, why are they calling their interposers "wafers"?

Who is online

Users browsing this forum: No registered users and 4 guests
GZIP: On