https://wccftech.com/tsmc-cowos-product ... terposers/
TSMC's demand for Chip-on-Wafer-on-Substrate (CoWoS) packing has skyrocketed, according to DigiTimes' unnamed source. Big names such as Nvidia, AMD, HiSilicon, Xilinx, and Broadcom are all knocking on TSMC's door to some CoWoS packing so they can use it for high bandwidth powered AI accelerators and ASICs over the past two weeks. This has led to TSMC ramping up production to full capacity at their fabs.
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