I have looked at the link kumora posted http://forums.anandtech.com/showpost.ph ... tcount=570
and using a paper shim is stupid in my eyes since it does not give you the closest distance between the IHS and the CPU die. Plus the way the Intel CPU retention bracket really pushes the CPU die hard into the 1150 socket I think the extra pressure on the CPU silicon die itself plus the liquid metal I would think it will give you much better heat transfer. If the IHS does not seem to be clamping down hard enough on the IHS i would put the paper shim on the outside of the IHS in between the IHS and retention Mechanism.
Chuck I have another question if you do not mind me asking? How was the Coollaborotry ultra to work with? Easy? Hard? Also how was the imprint from the IHS to the K60 using it. I am soon going to be replacing my TIM on my AIO liquid cooler and since i am running Sandy with the SOLDER. I just might replace the whole cooler since it has over 2 years on it. Also Chucky
This question has been killing me and since you have the hardware, Have you tried messing with the base clock settings/strap speeds and running a lower multiplier with a higher base clock @ the same overclock speeds say 4.5ghz to see if it makes a difference in performance, temps, Voltage in that does it need more or less to reach the same OC ETC. As of yet no one has said a word about it. Thanks for your replies.
Now my rant/opinion on Why Chipzilla DID NOT SLODER IVY and HASWELL
"Since I feel Intel Purposely put Horrible TIM on IVY bridge and Haswell to limit Overclocking on non Extreme cooling solutions like Phase Liquid Helium ETC, so it would not cut into Sandy Bridge-E sales, Since If you could safely cool a IVY or Haswell with a AIO liquid cooling solution or a Good Air cooler and have 5ghz plus Ivys and Haswells I feel that unless a person really needs all the extra PCI-E lanes ETC Sandy bridge-E Gives you. I think it would have cut into Sandy -E sales bigtime since there are many Work Station 1155 motherboards that support more then the 16 PCI lanes thanks to Plex chips and other solutions. Now i pray they Solder the new IVY bridge -E IHS on! since the new Ivy Bridge-EP processors will each have 80 PCIe lanes (an increase of 40 lanes).
I also think that Soldering the IHS to the Die increases Surface area since thee fluxless solder does run down the side of the CPU die itself say a mm or so. Therefore it pulls heat from the side of the CPU die itself. One mm of solder running down the side of a CPU die would substantially increase surface area along with puling heat from the side and not just the top of the CPU die since a thick layer of solder conducts heat 1000% better then a thick layer of TIM paste that would be on the side of a CPU die. I think that is why when people removed the IHS altogether and mounted there cooling solution directly onto the CPU dies there was not as much of a increase in cooling since the surface area was so small. Hope this make sense....But i really have the feeling Intel did not want IVY and Haswell lowering there Sandy-E sales for desktops. Just look How Sandy -E overclocks Damn good! Why? Solder:)
OK i do not know triganomatry so, Does anyone know how would i caculate the increase in CPU die sizes increase 1mm was added to all 4 sides of a 159.8mm2 die(this is a 3770k die). How much surface area would be gained.
I want to know this since I posted my hypothesis on my Intel did not solder Ivy and Haswell in the last post of this thread. Thank you ahead of time to anyone that answers this.
2600k@4848mhz @1.4v CM Nepton40XL 16gb Ram 2x EVGA GTX770 4gb Classified cards in SLI@1280mhz Stock boost on a GAP67-UD4-B3, SBlaster Z powered by TX-850 PSU pushing a 34" LG 21/9 3440-1440 IPS panel. Pieced together 2.1 sound system