Whether you use tape or paste depends on the type of chip, and what it's intended to make contact with.
Exposed die with a metal heatsink? Use thermal paste, or, if it was used previously, a thermal pad (thermal pads are used to fill gaps that paste will not)
BGA chip with basic contact of another metal/magnesium surface in the laptop? Either thermal tape or thermal pad.
i7-4790K @4.2GHz, GIGABYTE Z97X-UD5H-BK, 32GB GSkill RipJaws PC1866
Corsair 650D, Seasonic 1Kw Platinum PSU
Crucial M4 512GB, WD Raptor 600GB, WD Black 1TB, NEC 7200 DVDRW
Gigabyte GTX 1070 Founders Ed., X-Fi Titanium, Dell 2408WFP-HC