As the Intel Developer Forum looms, AMD is already out spilling the beans about its upcoming products at the IFA 2010 show in Berlin. The chipmaker posted pictures and specifications of its first "Fusion" accelerated processing units this morning, starting with this die shot:
Captioned "Low Power AMD Fusion APU Die Shot," the image above shows AMD's first chip to combine processor cores and graphics on the same die. Specifically, the chip includes two CPU cores based on the new Bobcat microarchitecture, one DirectX 11 graphics processor component, and a UVD video decoder capable of handling 1080p video. Here's a size comparison next to some European coins:
The biggest news here is the revelation of power envelopes for this chip. There will be two variants of this silicon: Zacate, which will have an 18W power envelope, and Ontario, which will have a TDP of only 9W. The company will aim Zacate at ultraportables and all-in-one desktops, while Ontario will be geared more toward netbooks and nettops. AMD expects the first products based on these chips to debut in the first quarter of next year.