Samsung builds 8GB LPDDR4 packages on its 10-nm process

With high-resolution screens, 4K video, and VR applications becoming more popular—or at least on the horizon—Samsung sees a need to increase the speed and capacity of the memory available to smartphone and tablet manufacturers. Today, the company introduced an 8GB mobile DRAM package powered by four of its new 16Gb LPDDR4 chips. Manufactured on Samsung's 10-nm process, these chips have a higher capacity than the company's 20-nm chips while purportedly consuming a similar amount of power.

Samsung claims that its new memory chips are not only tiny and power-efficient, but speedy, too. The 8GB LPDDR4 chips can operate at 4,266 MT/s. The memory is capable of transmitting data at 34GB/s on a 64-bit memory bus.

The diminutive size of Samsung's 8GB LPDDR4 memory packages should also make them attractive to smartphone manufacturers. They measure under 15 mm x 15 mm x 1 mm. Since they're thinner than one millimeter, these chips can be stacked with UFS memory or a mobile application processor. This characteristic should make the chips useful in devices with limited circuit board space. Samsung hopes to see the 8GB LPDDR4 packages rolling out in smartphones, tablets, and other devices soon.

Comments closed
    • danazar
    • 3 years ago

    I’m sure the next iPad Pro will still come with just 4GB of RAM. Apple’s mindset is that iOS developers shouldn’t get used to having lots of RAM available.

    On the other end of the scale, I’m sure Nvidia will try to sell some ridiculous high-end gaming tablet with 16GB of RAM.

    • RedBearArmy
    • 3 years ago

    I take it that this falls short of the power saving LPDDR4X ?

    • chuckula
    • 3 years ago

    The speed is really interesting if those numbers are correct.
    Hopefully it means we’ll also see more DDR4-4266 DIMMs becoming available on the market so that DDR4 can actually start to separate itself from DDR3.

    [Edit: I’m assuming the downvotes are from AMD fanboys who don’t want to see faster DDR4 memory for AMD’s upcoming APUs. Because spite.]

      • just brew it!
      • 3 years ago

      I seriously doubt you’ll be able to achieve those speeds in a DIMM form factor. The 4,266 MT/s figure likely assumes a configuration where you’re stacked with a SoC application processor, so extremely short trace lengths and no CPU or DIMM sockets in the signal path to mess with the signal integrity.

        • chuckula
        • 3 years ago

        Good point, the DIMM form factor adds a lot of electrical issues that make higher speeds harder in practical setups.

          • yuhong
          • 3 years ago

          And 2 DIMMs per channel (2DPC) only makes it worse. I wonder if in the long term 2DPC will be limited to things like Xeons, especially after 16Gbit DDR4 shows up.

        • RAGEPRO
        • 3 years ago

        A couple of these stacked on top of a Zen APU could be pretty fancy though.

      • Krogoth
      • 3 years ago

      Mainstream CPUs haven’t been running into any memory bandwidth issues though even on APUs.

      Dual-channel DDR4 with current JEDEC-spec DIMMs provide more then enough bandwidth to keep Skylake and its implementing successors happy. Quad-Channel DDR4 on Socket 2011v3 provides enough bandwidth to keep a monstrous 22-core Broadwell-EP chip happy.

Pin It on Pinterest

Share This