An article at X-bit Labs details an initiative by AMD to improve its retail processor packaging. Starting with the physical packaging, a new clamshell will allow for the nesting of clamshells in pairs, and through the clamshell itself, a unique barcode for each CPU will be visible.
Of greater interest, future boxed AMD processors will have improved heatsink/fan units. Retail HSFs will use fans with two ball bearings, whirring rather softly at less than 34dBA . To help the fan do its work, heatsinks will use more copper in its heatsinks, as well as a high efficiency phase changing material (TIM pad). In addition, the heatsinks will abandon the dual tab retention clip, in favor of a six tab design.