Intel to update Arizona fab
One of Intel's many chip fabrication plants is getting an upgrade, this one to 300mm wafer capacity and 65-nanometer process tech. From the announcement:
SANTA CLARA, Calif., April 21, 2004 - Intel Corporation today announced that it has begun a $2 billion construction project to convert a 200mm wafer fabrication facility to a state-of-the-art 300mm facility in Chandler, Ariz. The conversion of Fab 12 is scheduled to be completed in late 2005. The converted facility will begin initial production on 65-nanometer process technology.
"This project represents a first for Intel -- the first complete conversion of an existing 200mm wafer fab to a 300mm fab," said Bob Baker, Intel senior vice president and general manager, Technology and Manufacturing Group. "The flexibility of our factory designs allows us to completely and efficiently modify the interior of the cleanroom to accommodate the much larger 300mm production equipment.
The new Fab 12 will be Intel's fifth fab capable of 300mm wafer production. These five plants will provide, collectively, "the equivalent manufacturing capacity of about 10 200mm factories" thanks to the extra surface area on 300mm wafers.