SANTA CLARA, Calif., Nov. 2, 2005 – Intel Corporation has re-opened an advanced, high-volume semiconductor manufacturing facility in Chandler, Ariz., converting it to a leading-edge 300mm, 65nm process factory. Called Fab 12, the factory is Intel’s second volume-production fab using 65nm process technology produced on the industry’s largest wafer size (300mm), which provides the Intel fab with the potential to generate the world’s highest microprocessor output at the lowest cost. It is also the most technologically advanced, high-volume semiconductor manufacturing plant in the world building multi-core microprocessors.Impressive. $2 billion just to convert an existing facility to the new technology. These things are not cheap.
“The re-opening of Fab 12 marks a first for Intel and the semiconductor industry,” said Bob Baker, senior vice president, general manger, Intel Technology and Manufacturing Group. “The conversion of an existing factory to leading-edge technology – both larger wafer size and most advanced semiconductor technology – further adds to ’s manufacturing capability and improves our ability to better serve our customers.”
The Fab 12 conversion project, which began in 2004 and cost roughly $2 billion, was completed in approximately 18 months. Fab 12 is Intel’s fifth fab using 300mm wafers.