HKEPC has snagged another AMD
roadmap (in Chinese, translate here), this time for upcoming 65nm mobile processors. The chips will be based on a revision G design, and appear under the Turion 64 X2 and Mobile Sempron names. Two cores are expected—Tyler and Sherman—with respective 35W and 25W power envelopes. Revision G will also implement “100MHz granularity,” which should allow for load-dependent clock throttling in 100MHz increments, presumably with voltage drops for lower clock speeds. Despite these improvements, the 65nm chips will continue using the upcoming 638-pin Socket S1, which is expected to appear in June with the first 90nm Turion 64 X2s.
Speaking of 90nm Turion 64 X2s, the roadmap also reveals some additional details about unreleased 90nm mobile chips. Upcoming dual-core Taylor and single-core Keene chips will have 35W and 25W power envelopes, respectively, and will launch under the Turion 64 X2 and Mobile Sempron brands for Socket S1. The roadmap also shows a Socket AM2 Mobile Athlon 64 X2, likely based on the 62W Trinidad core, which should equip bulkier desktop replacement notebooks.
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