Samsung has developed a fingernail-sized device with enough memory and storage for high-end smartphones. This ePoP, or embedded package on package, combines 3GB of LPDDR3-1866 memory with 32GB of eMMC storage. Those components are typically separate, but they’ve been squeezed into a package that’s small enough to stack on top of an SoC. Samsung’s SoC-and-ePoP combo takes up just 15 x 15 x 1.4 mm.
Source: Samsung
Awww, isn’t the ePoP cute?
According to the press release, the DRAM "sports a 64-bit I/O bandwidth," which presumably refers to the width of the memory interface. There’s no mention of the speed or nature of the embedded flash.
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