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Thermalright showcases heat pipe-based cases

Cyril Kowaliski
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COMPUTEX — We were walking by Thermalright’s booth at Computex when something caught our eye: a pair of Thermalright’s HSC-series heat pipe-based cases that were on display.

The first one, the HSC-100, is in tower format, while the latter is a desktop case. Both are essentially giant heatsinks connecting the processor to fins across the case surface via multiple heat pipes. This form of cooling is efficient enough to remove the need for a fan to cool the processor. Nonetheless, system temperatures should be higher than with a standard fan-cooled setup setup—unless you crank the AC up, Thermalright says.